Title:
POSITIVE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2002214786
Kind Code:
A
Abstract:
To provide a positive photoresist composition excellent in PED stability and capable of preventing the occurrence of development defects in the production of a semiconductor device.
The positive photoresist composition contains a compound which generates an acid when irradiated with active light or radiation, a resin containing acid decomposable alicyclic olefin repeating units with a specified structure, anhydride repeating units with a specified structure and acid decomposable acrylic repeating units with a specified structure and having a dissolution rate in an alkali developing solution increased by the action of the acid and a nitrogen-containing basic compound having no aromatic ring.
Inventors:
FUJIMORI TORU
Application Number:
JP2001010481A
Publication Date:
July 31, 2002
Filing Date:
January 18, 2001
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F220/10; C08F220/42; C08F220/54; C08F222/04; C08F222/40; C08F232/08; C08K5/16; C08L33/04; C08L33/18; C08L33/24; C08L35/00; C08L45/00; C08L83/04; H01L21/027; (IPC1-7): G03F7/039; C08F220/10; C08F220/42; C08F220/54; C08F222/04; C08F222/40; C08F232/08; C08K5/16; C08L33/04; C08L33/18; C08L33/24; C08L35/00; C08L45/00; C08L83/04; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)
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