To obtain the positive photosensitive composition high in sensitivity to deep ultraviolet rays, especially, ArF excimer laser beams by incorporating a compound to produce an acid by irradiation with activated rays or radiation.
This positive photosensitive composition contains the compound to produce an acid by irradiation with activated rays or radiation and the resin having polycyclic alicyclic units each represented by the formula In which X is an Q or S atom or a -NH- group or the like; R1 is an H atom or an optionally substituted alkyl or cycloalkyl group or a group releasable by an acid or a -Y-R2 group; Y is a simple bond or a divalent single or composite groups selected from optionally substituted alkylene and amido and the like; R2 is a -COOH or -COOR3 or hydroxy groups; and R3 is an alkyl group or the like. The use of this composition permits the obtained positive photosensitive composition to have high transmittance, especially, to far ultraviolet rays, especially, those of ≤220 nm and superior in dry etching resistance.
SATO KENICHIRO
AOSO TOSHIAKI
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