Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM
Document Type and Number:
Japanese Patent JP2016040577
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition from which such a cured film can be formed that can achieve both of liquid repellency of a bank and a lyophilicity of a substrate and has excellent adhesiveness to a substrate, and a cured film.SOLUTION: The positive photosensitive resin composition comprises a novolac resin (A), a photosensitizer (B), a fluorocarbon resin (C) having at least one group selected from a set consisting of an epoxy group and an oxetanyl group, and a crosslinking agent (D).SELECTED DRAWING: None
Inventors:
TADOKORO KEISUKE
SUZUKI SHIGERU
SUZUKI SHIGERU
Application Number:
JP2014164493A
Publication Date:
March 24, 2016
Filing Date:
August 12, 2014
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/023; C08F220/24; C08F220/28; C08G59/00; C08G59/62; G03F7/004; G03F7/075; H01L51/50; H05B33/12; H05B33/22
Domestic Patent References:
| JP2012220860A | 2012-11-12 | |||
| JP2012220855A | 2012-11-12 | |||
| JP2016018691A | 2016-02-01 | |||
| JP2013190697A | 2013-09-26 | |||
| JP2013190699A | 2013-09-26 | |||
| JP2010008851A | 2010-01-14 | |||
| JP2009251327A | 2009-10-29 | |||
| JP2009251328A | 2009-10-29 | |||
| JP2001242616A | 2001-09-07 | |||
| JPH0743899A | 1995-02-14 |
Foreign References:
| WO2013133392A1 | 2013-09-12 | |||
| WO2013118680A1 | 2013-08-15 | |||
| US20110294243A1 | 2011-12-01 |
Attorney, Agent or Firm:
Masayuki Masabayashi