To provide a positive photosensitive resin composition having high sensitivity, high resolution and high residual film ratio.

The positive photosensitive resin composition comprises an alkali-soluble resin (A) and a naphthoquinone-diazidosulfonic ester compound of phenol (B) represented by Formula (1), wherein R1 is a 1-15C alkylene or substituted alkylene group or a 2-15C alkenylene or substituted alkenylene group; R2-R5 are each H, halogen, an alkyl or substituted alkyl group, a cycloalkyl or substituted cycloalkyl group, an aryl or substituted aryl group, a 1-5C alkoxy group, a 1-5C acyl group or a 1-5C ester group, and R2-R5 may be the same or different.