Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3449925
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. having high sensitivity, capable of obtaining a pattern with a high rate of a residual film and excellent in adhesion to a sealing resin by composing the risin of specified polyamide, a photosensitive diazoquinone compd. and a specified phenol compd.
SOLUTION: A photosensitive resin comopsn. consists of 100 pts.wt. polyamide represented by formula I, 1-100 pts.wt. a photosensitive diazoquinone compd. and 1-30 pts.wt. a phenol compd. represented by formula II. In the formula I, X is a tetravalent cyclic compd. group, Y is a divalent cyclic compd. group, Z is-R1Si(R3)(R4)-O-Si(R3)(R4)-R2- (each of R1 and R2 is a divalent org. group and each of R3 and R4 is a monovalent org. group) E is an alkenyl group or an aliphatic or a cyclic compd. group having the alkenyl group, each of a, b is a molar fraction, a+b=100 mol.%, (a) is 60.0-100.0 mol.%, (b) is 0-40.0 mol.% and (n) is 2-500. In the formula II, R5 and R6 are each an H atom or a alkyl group and R7-R10 are each an H atom, a halogen atom, an alkyl group or the like.
Inventors:
Hiroaki Makabe
Naoshi Takeda
Toshio Bamba
Takashi Hirano
Naoshi Takeda
Toshio Bamba
Takashi Hirano
Application Number:
JP21769298A
Publication Date:
September 22, 2003
Filing Date:
July 31, 1998
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G03F7/022; C08G69/32; C08G73/22; C08K5/13; C08K5/23; C08L77/06; G03F7/037; G03F7/075; H01L21/027; (IPC1-7): G03F7/022; C08G69/32; C08K5/13; C08K5/23; C08L77/06; G03F7/037; H01L21/027
Domestic Patent References:
| JP8123034A | ||||
| JP5197153A | ||||
| JP9127697A | ||||
| JP9302221A | ||||
| JP7500932A |
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