Title:
ポジ型感光性樹脂組成物
Document Type and Number:
Japanese Patent JP6700020
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition characterized in low out-gassing property and having good sensitivity and resolution and characteristics equal to those of a general-purpose photosensitive resin composition.SOLUTION: The positive photosensitive resin composition comprises (a) a polyalkenyl phenol resin represented by formula (1), (b) an alkali aqueous solution-soluble resin having an epoxy group and a phenolic hydroxyl group, and (c) a quinonediazide compound. In the formula (1), R, Rand Rrepresent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or the like.SELECTED DRAWING: None
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Inventors:
Kentaro Furue
Yuki Ohno
Yuki Ohno
Application Number:
JP2015207059A
Publication Date:
May 27, 2020
Filing Date:
October 21, 2015
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
G03F7/023; C08F220/20; C08G8/30; C08G59/16; G03F7/20; H01L51/50; H05B33/10; H05B33/22
Domestic Patent References:
| JP2015145912A | ||||
| JP2011138116A | ||||
| JP2010204151A | ||||
| JP2006133585A | ||||
| JP2015087818A | ||||
| JP2005154475A | ||||
| JP2001146510A | ||||
| JP2007171572A | ||||
| JP2014202849A |
Foreign References:
| US20150160554 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Satoshi Deno
Naori Kota
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Satoshi Deno
Naori Kota