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Title:
POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2000147770
Kind Code:
A
Abstract:

To provide a positive radiation-sensitive resin composition superior in sensitivity and resolution and good in environmental resistance.

The positive radiation-sensitive resin composition comprises (A) an alkali-soluble resin having phenolic hydroxyl groups or at least one part of the above hydroxyl groups being protected with an acid-decomposable protective group, (B) a compound having a partial structure decomposable by an action of an acid and capable of producing a group for giving alkali- solubility upon decomposition and (C) a compound to be decomposed by activated rays or radiation resulting in generating an acid and the compound (B) can be embodied by a compound having, as the partial structure to be decomposed by an acid and to give the alkali solubility, a partial structure of an optionally substituted ≥7C alkyl carbonate group.


Inventors:
KAMEYAMA YASUHIRO
Application Number:
JP31755298A
Publication Date:
May 26, 2000
Filing Date:
November 09, 1998
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
H01L21/027; G03F7/039; (IPC1-7): G03F7/039; H01L21/027
Attorney, Agent or Firm:
Hasegawa Moji