POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD FOR FORMING RESIST PATTERN

Title:

POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD FOR FORMING RESIST PATTERN

Document Type and Number:

Japanese Patent JP2007212990

Kind Code:

A

Abstract:

To provide a positive resist composition for immersion exposure which suppresses material elution in immersion exposure, and a method for forming a resist pattern.

The positive resist composition for immersion exposure contains a resin component (A) having an acid-dissociable dissolution inhibiting group, of which the alkali solubility is increased by the action of an acid, and an acid generator component (B) which generates an acid when exposed to light, wherein the resin component (A) contains a cyclic main chain polymer (A1) and a noncyclic main chain polymer (A2) which has a constitutional unit (a) derived from an acrylic acid as the main chain.

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Inventors:

SASAKI KAZUHITO
SHIMIZU HIROAKI
ENDO KOUTARO
OSHITA KYOKO

Application Number:

JP2006117962A

Publication Date:

August 23, 2007

Filing Date:

April 21, 2006

Export Citation:

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Assignee:

TOKYO OHKA KOGYO CO LTD

International Classes:

C08F32/00; G03F7/039; H01L21/027

Attorney, Agent or Firm:

Sumio Tanai
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai

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