Title:
ポジ型レジスト組成物及びそれを用いたパターン形成方法
Document Type and Number:
Japanese Patent JP4452563
Kind Code:
B2
Abstract:
A positive resist composition satisfying high sensitivity, high resolution, good pattern profile and good in-vacuum PED property at the same time, and a pattern forming method using the composition, are provided, which is a positive resist composition comprising: (A) a resin which is insoluble or sparingly soluble in an alkali developer and becomes soluble in an alkali developer under the action of an acid; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) an organic basic compound, wherein (A1) a resin containing a repeating unit having a specific structure and (A2) a resin other than the resin (A1) are contained as the resin of the component (A); and a pattern forming method using the composition.
Inventors:
Koji Shirakawa
Tomoya Sasaki
Tomoya Sasaki
Application Number:
JP2004175091A
Publication Date:
April 21, 2010
Filing Date:
June 14, 2004
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; C08F12/24; G03C1/492; G03F7/004; G03F7/033; H01L21/027
Domestic Patent References:
| JP2004012886A | ||||
| JP2003345023A | ||||
| JP2002107920A | ||||
| JP10204125A |
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa