POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING SAME

Title:

POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING SAME

Document Type and Number:

Japanese Patent JP2006023489

Kind Code:

A

Abstract:

To provide a positive resist composition which ensures few development defects and excels in the margin of pattern falling, and a pattern forming method using the same.

The chemically amplified positive resist composition contains (A) a resin containing a carboxyl group in a backbone or a side chain thereof and having solubility in an alkali developer increased by the action of an acid and (B) an epoxy compound. The pattern forming method using the same is also provided.

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Inventors:

TARUYA SHINJI

Application Number:

JP2004200857A

Publication Date:

January 26, 2006

Filing Date:

July 07, 2004

Export Citation:

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Assignee:

FUJI PHOTO FILM CO LTD

International Classes:

G03F7/039; C08F20/06; C08F22/00; C08G59/20; G03F7/004; G03F7/033; H01L21/027

Attorney, Agent or Firm:

Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada

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