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Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING IT
Document Type and Number:
Japanese Patent JP2007086431
Kind Code:
A
Abstract:

To provide a positive resist composition for simultaneously satisfying high sensitivity, high resolution, an excellent pattern shape and excellent line edge roughness in the positive resist composition and a pattern forming method using it used preferably in an ultra-micro lithography process such as manufacture of an ultra LSI and a high-capacity microchip and the other photo-publication process, and to provide the pattern forming method using it.

The positive resist composition contains (A) a resin increasing solubility to an alkali developer due to the action of an acid, (B) a compound generating the acid due to irradiation with an active light or radiation, and (C) an aromatic compound having 2,000 mol.wt. or less having a lactone group. The pattern forming method using it is provided.


Inventors:
MIZUTANI KAZUYOSHI
HIRANO SHUJI
Application Number:
JP2005275339A
Publication Date:
April 05, 2007
Filing Date:
September 22, 2005
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/039; C08F212/14; C08F220/12; C08F220/42; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa