Title:
POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP3520995
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photoresist composition whose development defects are reduced in manufacturing of the positive photoresist composition and a pattern forming method using the same.
SOLUTION: The positive photoresist composition contains a resin which includes a specific repeating constitutional unit and whose dissolution rate in an alkaline developing solution is increased by the effect of an acid and a compound which generates the acid by irradiation with active rays or radiations and patterns are formed by using the positive photoresist composition.
Inventors:
Sato, Kenichiro
Nakao, Hajime
Nakao, Hajime
Application Number:
JP2003290249A
Publication Date:
April 19, 2004
Filing Date:
August 08, 2003
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F220/10; C08F232/00; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F220/10; C08F232/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
小栗 昌平 （外４名）