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Title:
ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物、化合物
Document Type and Number:
Japanese Patent JP5308874
Kind Code:
B2
Abstract:

To provide a positive resist composition capable of forming a resist pattern of a good shape with reduced LWR by superior sensitivity, a high molecular compound that can be used as a base material of the positive resist composition, a compound that can be used for synthesizing a structural unit of the high molecular compound, and a resist pattern forming method.

The positive resist composition contains a base material component (A) of which solubility to alkali developing solution increases by the action of acid, and an acid generator component (B) that generates acid by exposure. The base material component (A) contains a high molecular compound (A1) having a structural unit (a0) including an acid dissociable dissolution inhibiting group, and the acid dissociable dissolution inhibiting group in the structural unit (a0) includes a group expressed by a formula (a0-0-1). In the formula (a0-0-1), R1' and R2' independently represent a hydrogen atom or a 1-5C alkyl group respectively, Y1represents a single bond or a divalent linking group, and R3represents a cyclic group including -SO2- in its cyclic skeleton.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Yoshimuro Komuro
Yoshiyuki Utsumi
Hideo Haneda
Atsushi Iwashita
Application Number:
JP2009055243A
Publication Date:
October 09, 2013
Filing Date:
March 09, 2009
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/039; C07D327/04; C08F8/34; C08F12/24; G03F7/004
Domestic Patent References:
JP2003280199A
JP2008521039A
JP2007031355A
JP2009062491A
JP2010083873A
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi