Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2003280203
Kind Code:
A
Abstract:
To provide a positive resist composition having satisfactory transmittance when an exposure light source of ≤160 nm, concretely F2 excimer laser light (157 nm) is used and ensuring improved line edge roughness and development defects.
The positive resist composition comprises (A) a compound which generates an acid upon irradiation with an actinic ray or a radiation, (B) an organic fluoropolymer whose solubility in an alkali developer is increased by the action of an acid having a specified structure and (C) a solvent.
Inventors:
MIZUTANI KAZUYOSHI
KANNA SHINICHI
SASAKI TOMOYA
KANNA SHINICHI
SASAKI TOMOYA
Application Number:
JP2002086118A
Publication Date:
October 02, 2003
Filing Date:
March 26, 2002
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F212/14; C08F232/08; H01L21/027; (IPC1-7): G03F7/039; C08F212/14; C08F232/08; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)
Previous Patent: CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION
Next Patent: METHOD FOR PRODUCING PLANOGRAPHIC PRINTING PLATE
Next Patent: METHOD FOR PRODUCING PLANOGRAPHIC PRINTING PLATE