Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2003302762
Kind Code:
A
Abstract:
To provide a positive photoresist composition for far UV exposure excellent in edge roughness, etching resistance and adhesion.
The positive resist composition comprises (A) a photoacid generator, (B) a resin which has a repeating unit having a specified structure and a (meth)acrylic repeating unit and is decomposed by the action of an acid to increase solubility in an alkali developer and (C) an alcohol compound having a 7-15C alicyclic hydrocarbon group and an alcoholic hydroxyl group.
Inventors:
SATO KENICHIRO
KAWABE YASUMASA
KAWABE YASUMASA
Application Number:
JP2002109499A
Publication Date:
October 24, 2003
Filing Date:
April 11, 2002
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
C08F220/00; C08F232/00; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; C08F220/00; C08F232/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)