POSITIVE RESIST COMPOSITION - SUMITOMO CHEMICAL CO

Title:

POSITIVE RESIST COMPOSITION

Document Type and Number:

Japanese Patent JP2003345024

Kind Code:

A

Abstract:

To provide a positive resist composition having improved pattern profile, particularly, roughness without causing basic ability such as sensitivity and resolution to fall significantly.

The positive resist composition contains (A) at least one resin selected from a group comprising (1) a resin which itself is insoluble or hardly soluble with an alkali aqueous solution but causes chemical changes to be soluble with an alkali aqueous solution by the effect of an acid (excluding a novolac resin) and (2) an alkali soluble resin, (B) a novolac resin with a protective group introduced which can be opened by the effect of an acid, and (C) an acid generating agent.

More Like This:

WO/2009/142142	ALICYCLIC STRUCTURE-CONTAINING COMPOUND, (METH)ACRYLATE, (METH)ACRYLIC POLYMER AND POSITIVE RESIST COMPOSITION CONTAINING THE (METH)ACRYLIC POLYMER
WO/2013/047902	ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN

Inventors:

NANBA KATSUHIKO
SUETSUGU MASUMI
OCHIAI KOSHIRO

Application Number:

JP2003075249A

Publication Date:

December 03, 2003

Filing Date:

March 19, 2003

Export Citation:

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Assignee:

SUMITOMO CHEMICAL CO

International Classes:

G03F7/039; C08F12/22; C08F20/18; C08F20/28; C08F20/44; H01L21/027; (IPC1-7): G03F7/039; C08F12/22; C08F20/18; C08F20/28; C08F20/44; H01L21/027

Attorney, Agent or Firm:

Takashi Kuboyama (2 outside)

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