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Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2004101934
Kind Code:
A
Abstract:

To provide a positive resist composition which is suitably used for use of an exposure light source of ≤160 nm, specially, F2 excimer laser light (157 nm) and shows sufficient transparency in use of the light source of 157 nm and has high sensitivity, a high contrast, and superior coating property.

This positive resist composition contains a resin, having at least one repetitive unit which has an acid decomposition group or an alkali-soluble group and has at least one fluorine atom, at a side chain.


Inventors:
SASAKI TOMOYA
MIZUTANI KAZUYOSHI
KANNA SHINICHI
Application Number:
JP2002264489A
Publication Date:
April 02, 2004
Filing Date:
September 10, 2002
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F12/04; C08F20/10; C08F32/00; H01L21/027; (IPC1-7): G03F7/039; C08F12/04; C08F20/10; C08F32/00; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Kuriu