Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2004170871
Kind Code:
A
Abstract:
To provide a positive resist composition showing sufficient transparency when a light source at ≤160 nm wavelength, specifically, F2 excimer laser light (at 157 nm) is used, having high sensitivity and excellent dissolution contrast, and favorable dry etching durability.
The positive resist composition contains: a resin which comprises a combination of specified repeating units and increases the solubility with an alkali developer solution by the effect of an acid; and a compound which generates an acid by the effect of active rays or radiation.
Inventors:
SASAKI TOMOYA
MIZUTANI KAZUYOSHI
KANNA SHINICHI
MIZUTANI KAZUYOSHI
KANNA SHINICHI
Application Number:
JP2002339432A
Publication Date:
June 17, 2004
Filing Date:
November 22, 2002
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F16/12; C08F32/04; C08F32/08; H01L21/027; (IPC1-7): G03F7/039; C08F16/12; C08F32/04; C08F32/08; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada