Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2005037777
Kind Code:
A
Abstract:
To provide a positive resist composition which is suitable for use under an exposure light source of ≤160 nm, particularly F2 excimer laser light (157 nm) and suppresses occurrence of development defects.
This positive resist composition contains (A) a fluorine-containing resin which has a structure in which fluorine has been substituted on a backbone of a polymer skeleton and a group represented by a specified structure and is decomposed by the action of an acid to increase solubility in an alkali developing solution, (B) a compound which generates an acid upon irradiation with an actinic ray, and (C) a compound having three or more hydroxyl groups or substituted hydroxyl groups.
Inventors:
FUJIMORI TORU
Application Number:
JP2003276092A
Publication Date:
February 10, 2005
Filing Date:
July 17, 2003
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F14/18; C08F16/24; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F14/18; C08F16/24; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
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