Title:
POSITIVE TYPE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2001318465
Kind Code:
A
Abstract:
To provide a positive type resist composition having good PED, sensitivity and resolving power in the formation of contact holes in relation to lithography using a short-wavelength exposure light source for ultra-microfabrication and a positive type chemical amplification resist.
The positive type resist composition contains (A) a resin containing repeating structural units each having a specified acid decomposable group and having the velocity of dissolution in an alkali developing solution increased by the action of an acid and (B) a compound which generates the acid when irradiated with active light or radiation.
Inventors:
SATO KENICHIRO
AOSO TOSHIAKI
AOSO TOSHIAKI
Application Number:
JP2000138882A
Publication Date:
November 16, 2001
Filing Date:
May 11, 2000
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F220/00; C08F222/04; C08F232/08; C08K5/00; C08L33/04; C08L35/00; C08L45/00; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F220/00; C08F222/04; C08F232/08; C08K5/00; C08L33/04; C08L35/00; C08L45/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)
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