Title:
POSITIVE TYPE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2001264985
Kind Code:
A
Abstract:
To provide a chemical amplification type positive type photoresist composition which ensures improved edge roughness of a pattern, gives an excellent resist pattern profile and has high sensitivity.
The positive type resist composition contains (A) resin containing a specified cyclic structure in the principal chain, having ≤5% content of a monomer corresponding to repeating structural units constituting the resin based on the total pattern area by GPC and having velocity of dissolution in an alkali developing solution increased by the action of an acid and (B) a compound which generates the acid when irradiated with active light or radiation.
Inventors:
SATO KENICHIRO
AOSO TOSHIAKI
AOSO TOSHIAKI
Application Number:
JP2000080519A
Publication Date:
September 28, 2001
Filing Date:
March 22, 2000
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F6/12; C08F8/14; C08F222/06; C08F222/10; C08F222/40; C08F232/00; C08K5/3492; C08K5/353; C08K5/41; C08K5/42; C08L35/00; C08L45/00; H01L21/027; (IPC1-7): G03F7/039; C08F6/12; C08F8/14; C08F222/06; C08F222/10; C08F222/40; C08F232/00; C08K5/3492; C08K5/353; C08K5/41; C08K5/42; C08L35/00; C08L45/00; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)