Title:
POSITIVE TYPE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2004219822
Kind Code:
A
Abstract:
To provide a positive type resist composition exhibiting sufficient permeability in the use of F2 excimer laser light (157 nm) as an exposure light source and satisfying coating property and compensating development defect.
In the positive type resist composition containing a fluorine atom-containing resin (A) having a structure in which fluorine atom is replaced in the main chain and/or the side chain of a polymer skeleton, decomposed by the action of an acid and having a group increasing the solubility in an alkali developer and a compound (B) producing an acid by the irradiation with active light, the resin of (A) component has a repeating unit having hydroxyl alkyl group.
Inventors:
MIZUTANI KAZUYOSHI
Application Number:
JP2003008380A
Publication Date:
August 05, 2004
Filing Date:
January 16, 2003
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F212/14; C08F214/18; C08F216/14; C08F220/12; C08F220/28; C08F232/00; H01L21/027; (IPC1-7): G03F7/039; C08F212/14; C08F214/18; C08F216/14; C08F220/12; C08F220/28; C08F232/00; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
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