Title:
後処理装置、後処理装置の制御方法
Document Type and Number:
Japanese Patent JP7392894
Kind Code:
B2
Abstract:
To provide a post-processing device that suppresses the deformation of a medium in a stacker and enables smooth post-processing.SOLUTION: The post-processing device includes: a stacker where a medium is temporarily loaded; a post-processing part that performs post-processing on the medium loaded on the stacker; a paper discharge tray where the medium to be discharged is stacked; and a suppressing part that suppresses the deformation of the medium in the condition where it is loaded on the stacker.SELECTED DRAWING: Figure 12
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Inventors:
Hidetoshi Kodama
Hirohisa Adachi
Yutaro Harada
Hirohisa Adachi
Yutaro Harada
Application Number:
JP2023104007A
Publication Date:
December 06, 2023
Filing Date:
June 26, 2023
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B65H29/70; B65H29/22; B65H31/26
Domestic Patent References:
| JP2015182835A | ||||
| JP2013010213A | ||||
| JP2007084337A |
Attorney, Agent or Firm:
Satoshi Nakai
Hiroki Matsuoka
Masayuki Imamura
Hiroki Matsuoka
Masayuki Imamura