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Title:
POWDER COMPOSITION FOR FORMING CONDUCTIVE PATTERN FOR CERAMIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH0521919
Kind Code:
A
Abstract:

PURPOSE: To prevent the peeling of a ceramic board and a conductive pattern after baking by using powder obtained by previously heating and treating Ag-Pd group mixed powder in an oxidizing atmosphere as powder for forming the conductive pattern.

CONSTITUTION: Powder acquired by heating and treating the mixture of 70-95 pts.wt. Ag powder and 5-30 pts.wt. Pd powder in an oxidizing atmosphere is employed as powder for forming a conductive pattern. Powder, which is used normally and has approximately 0.3-10μm mean particle size, can be employed as the powder of Ag and Pd. It is favorable because the powder of Ag-Pd acquired is equalized and the conductive pattern is shrunk uniformly that not more than 2μm Ag powder and Pd powder are used particularly. The Ag powder and Pd powder are mixed by a conventional means, and heated and treated in an oxidizing atmosphere, thus manufacturing a powder composition for shaping the conductive pattern.


Inventors:
HANADA TOSHIHIKO
KAWAMINAMI SHUICHI
KAMIAKA HIDETO
TAKAHASHI SHIGERU
Application Number:
JP19701691A
Publication Date:
January 29, 1993
Filing Date:
July 11, 1991
Export Citation:
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Assignee:
NIHON CEMENT
International Classes:
H01B1/02; C09D5/24; H01B1/16; H05K1/09; (IPC1-7): C09D5/24; H01B1/02; H01B1/16; H05K1/09
Attorney, Agent or Firm:
Noriaki Miyakoshi



 
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