Title:
粉粒繊維系材料充填方法及びその装置
Document Type and Number:
Japanese Patent JP5219260
Kind Code:
B2
More Like This:
Inventors:
Hidenori Kachi
Application Number:
JP2008121778A
Publication Date:
June 26, 2013
Filing Date:
May 08, 2008
Export Citation:
Assignee:
Tokiwa Co., Ltd.
International Classes:
B65B39/00; B65B1/04
Domestic Patent References:
JP6507864A | ||||
JP2000254986A | ||||
JP7040902A | ||||
JP2004211266A | ||||
JP5044114A |
Previous Patent: MAGNETIC POLE* COIL ASSEMBLAGE
Next Patent: AUTOMATIC PROCESSOR OF WIRE ELECTRIC ELEMENT LEAD
Next Patent: AUTOMATIC PROCESSOR OF WIRE ELECTRIC ELEMENT LEAD