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Title:
POWDER MOLDING DEVICE AND POWDER MOLDING METHOD
Document Type and Number:
Japanese Patent JP3780842
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a powder molding device capable of enhancing positional accuracy in molding and accuracy of the height of a punch unit, and capable of adapting the continuous production of multi-kind molding products.
SOLUTION: The device is provided with a carrier table (metal mold carrier mechanism) 8 for carrying a metal mold 2 composed of a dies 5 and upper and lower punch units 7 at least among a powder feeding stage A, a press- molding stage B, and a molding taking out stage D, a press-driving mechanism for making press molding by driving the upper and lower punch units 7 at the press-molding stage B, first and second connection mechanisms for connecting the lower punch unit 7 to the press-driving mechanism when carried to the metal mold press-molding stage B and releasing the connection when the metal mold is carried to the next stage, and a unit holding mechanism for holding the lower punch unit 7 during the carrying to the next stage.


Inventors:
Makoto Kitamura
Yoshio Oda
Shigemi Takahashi
Application Number:
JP2000367967A
Publication Date:
May 31, 2006
Filing Date:
December 04, 2000
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B30B11/00; B28B3/02; B28B3/08; B28B5/08; B30B11/04; B30B11/08; (IPC1-7): B30B11/00; B30B11/08
Domestic Patent References:
JP3114699A
JP5057496A
JP2000141097A
JP8019588A
Attorney, Agent or Firm:
Tsutomu Shimoichi