電力表面取り付けの発光ダイ・パッケージ

Title:

電力表面取り付けの発光ダイ・パッケージ

Document Type and Number:

Japanese Patent JP4602345

Kind Code:

B2

Abstract:

A light emitting die package is disclosed. The die package includes a substrate (20), a reflector plate (40), and a lens (50). The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the substrate is made from an electrically conductive material, the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material. The substrate has traces for connecting to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covers the mounting pad. heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

Inventors:

Low, bang, pee
Andrews, Peter, S

Application Number:

JP2006536764A

Publication Date:

December 22, 2010

Filing Date:

October 20, 2004

Export Citation:

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