Title:
POWER DISTRIBUTING BOARD FOR RESIDENCE
Document Type and Number:
Japanese Patent JP2001086610
Kind Code:
A
Abstract:
To obtain a power distributing board for residence that can save the time required for mounting to the wall, procedures and cost with the simplified structure.
A mounting groove 3 is provided almost at the center of a base board 2, a mounting hole 4 for mounting on the base board 2 and a wiring hole 5 for inserting the wire are provided in the mounting groove 3, a power distributing board 1 for residence is installed by embedding to the wall surface with the mounting groove 3 provided opposed to an intermediate pole 7 of the wall surface and the power distributing board for residence is installed by exposing to the wall surface with the mounting groove 3 provided opposed to the duct provided at the wall surface.
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Inventors:
MIZUNO KOJI
Application Number:
JP25824799A
Publication Date:
March 30, 2001
Filing Date:
September 13, 1999
Export Citation:
Assignee:
KAWAMURA ELECTRIC INC
International Classes:
H02B1/40; H02B3/00; (IPC1-7): H02B1/40; H02B3/00
Domestic Patent References:
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