Title:
Power module
Document Type and Number:
Japanese Patent JP6040803
Kind Code:
B2
Inventors:
Sotaro Oi
Application Number:
JP2013033019A
Publication Date:
December 07, 2016
Filing Date:
February 22, 2013
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L25/07; H01L23/12; H01L23/36; H01L25/18
Domestic Patent References:
| JP2006319313A | ||||
| JP2000183212A | ||||
| JP2013038344A | ||||
| JP2009044152A | ||||
| JP2012094867A | ||||
| JP2003086747A |
Attorney, Agent or Firm:
Masakazu Aoyama