Title:
パワーモジュール
Document Type and Number:
Japanese Patent JP7011372
Kind Code:
B2
Abstract:
To provide a power module that can exhibit a required cooling function for a heat generating component mounted on the mounting surface of a circuit board in a manner in which an unnecessary increase in the size of the circuit board is suppressed when a heat sink is mounted on the side of the circuit board.SOLUTION: A power module 1 includes first configuration component portions 51 and 61 in which first heat conducting members 50 and 60 are in contact with first heat generating components 21 and 25, and that extend in a third direction in a circuit board 10, and second configuration component portions 55 and 65 in which the first configuration component portions 51 and 61 are connected to a heat sink 40 and that extend in a second direction in the circuit board 10, and second heat conducting members 70 and 80 are in contact with second heat generating components 31 and 35, are separated from the second configuration component portions 55 and 65 in the third direction, and overlap with the second configuration component portions 55 and 65 when viewed along the third direction.SELECTED DRAWING: Figure 1
Inventors:
Hiroyuki Chiba
Application Number:
JP2018014682A
Publication Date:
January 26, 2022
Filing Date:
January 31, 2018
Export Citation:
Assignee:
Hitachi Astemo, Ltd.
International Classes:
H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| JP10125830A | ||||
| JP7106782A | ||||
| JP2014082474A | ||||
| JP2011035352A |
Attorney, Agent or Firm:
Kawamoto Manabu
Mikio Kuruyama
Nobuyoshi Tahara
Mikio Kuruyama
Nobuyoshi Tahara