Title:
多層回路基板に基づくパワーモジュール
Document Type and Number:
Japanese Patent JP7145075
Kind Code:
B2
Abstract:
A power module comprises at least one power semiconductor device with an electrical top contact area on a top side; and a multi-layer circuit board with multiple electrically conducting layers which are separated by multiple electrically isolating layers, the electrically isolating layers being laminated together with the electrically conducting layers; wherein the multi-layer circuit board has at least one cavity, which is opened to a top side of the multi-layer circuit board, which cavity reaches through at least two electrically conducting layers; wherein the power semiconductor device is attached with a bottom side to a bottom of the cavity; and wherein the power semiconductor device is electrically connected to a top side of the multi-layer circuit board with a conducting member bonded to the top contact area and bonded to the top side of the multi-layer circuit board.
Inventors:
Morne, Fabian
Süderer, Jurgen
Traube, Felix
Süderer, Jurgen
Traube, Felix
Application Number:
JP2018544498A
Publication Date:
September 30, 2022
Filing Date:
February 23, 2017
Export Citation:
Assignee:
HITACHI ENERGY SWITZERLAND AG
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2015095472A | ||||
| JP2002373971A | ||||
| JP2011253950A |
Foreign References:
| WO2012026418A1 |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office