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Patent Searching and Data


Title:
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2005277012
Kind Code:
A
Abstract:

To provide a power semiconductor device having a nut for attaching external wiring for power that is capable of preventing problems such as the deformation of a main electrode terminal, nut dropout or the like.

The power semiconductor device has the main surface of a case, a resin case formed of resin, and a nut. The nut has a main body that longitudinally extends, and a flange that extends substantially perpendicularly to the longitudinal direction and has a main surface opposing the main surface of the case. In addition, the nut is embedded in the resin case such that the main surface of the flange is supported by the resin. This enables the prevention of the problems such as the deformation of the main electrode terminal, nut dropout or the like.


Inventors:
KAWANISHI TOSHIYUKI
Application Number:
JP2004086677A
Publication Date:
October 06, 2005
Filing Date:
March 24, 2004
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01R4/38; H01L25/07; H01L25/18; (IPC1-7): H01L25/07; H01L25/18; H01R4/38
Attorney, Agent or Firm:
Osamu Kawamiya
Takuji Yamada