Title:
POWER SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE
Document Type and Number:
Japanese Patent JP2022070483
Kind Code:
A
Abstract:
To provide a power semiconductor module that enables various types of external connection terminals to be easily connected with a plurality of terminal parts of a lead frame.SOLUTION: A power semiconductor module 1 comprises a lead frame 10, at least one power semiconductor chip 20, a plurality of external connection terminals 30, and an encapsulation member 42. The lead frame 10 includes a plurality of terminal parts 13. The plurality of terminal parts 13 respectively include a plurality of portions 13a exposed from the encapsulation member 42. The plurality of external connection terminals 30 respectively include a plurality of pairs of holding pieces 32. The plurality of pairs of holding pieces 32 respectively hold the plurality of portions 13a of the plurality of terminal parts 13.SELECTED DRAWING: Figure 2
Inventors:
SUZUKI YUICHIRO
SAKUTANI KAZUHIKO
SAKUTANI KAZUHIKO
Application Number:
JP2020179572A
Publication Date:
May 13, 2022
Filing Date:
October 27, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L25/07; H01L23/29; H01L23/36
Attorney, Agent or Firm:
Fukami patent office