Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POWER SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP3411437
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To improve a module by which a plurality of power semiconductor devices of a bridge circuit are incorporated with related circuits in viewpoints of the cost and performance.
SOLUTION: A plurality of device chips 10 which are divided up with the respective semiconductor devices, a plurality of driving chips 20 which are provided corresponding to the device chips 10 and in which driving circuits and protective circuits which are operated on the same potential are integrated, a signal processing chip 30 which is provided in common to the driving chips 20 and consists of an integrated circuit which processes signals related to the driving chips 20 so as to be matched with the operation potentials of the driving chips 20, wiring conductors 40 corresponding to a plurality of the semiconductor devices and signal lines 50 with which the driving chips 20 and the signal 30 are connected to each other are housed in a common case 60 to construct a module 70. With this constitution, junction/isolation structures between the driving chips 20 and the signal processing chip 30 can be eliminated or simplified, the chip sizes and the cost can be reduced, the noise interference of the signal lines 50 and mutual interference between signals can be suppressed and the operation reliability of the module can be improved.


Inventors:
Tokuyasu Terasawa
Application Number:
JP3598196A
Publication Date:
June 03, 2003
Filing Date:
February 23, 1996
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H02M7/00; H02M7/5387; (IPC1-7): H02M7/5387
Domestic Patent References:
JP89653A
JP6169578A
JP65847A
JP4308475A
JP3270677A
Attorney, Agent or Firm:
Masaharu Shinobe