Title:
Power semiconductor module
Document Type and Number:
Japanese Patent JP6330436
Kind Code:
B2
Abstract:
A power semiconductor module is equipped with: a metal base; semiconductor chips electrically connected with and fixed to the metal base; and an insulating substrate fixed to the metal base and having a circuit plate on one surface. Additionally, the power semiconductor module is further equipped with a circuit board that is provided so as to face the semiconductor chips and the insulating substrate and that electrically connects electrodes of the semiconductor chips and the circuit plate of the insulating substrate. Further, the power semiconductor module is equipped with a conductive post that is electrically connected to at least one of either the electrodes of the semiconductor chips or the circuit plate of the insulating substrate while being electrically connected to the metal film of the circuit board.
Inventors:
Tetsuya Inaba
Yoshinari Ikeda
Yoshinari Ikeda
Application Number:
JP2014075640A
Publication Date:
May 30, 2018
Filing Date:
April 01, 2014
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L25/07; H01L21/60; H01L25/18
Domestic Patent References:
| JP6295965A | ||||
| JP1122146A | ||||
| JP2010165764A | ||||
| JP2011082303A | ||||
| JP2007287833A | ||||
| JP2004111619A |
Foreign References:
| WO2013136895A1 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
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