To reduce the cost and complexity of the entire electronic integrated device by forming, related to an inter-substrate conductive mount, first and second compliant solder joints at the interface between a substrate and an adjoining substrate.
An inter-substrate conductive mount 440 which is a pin of a power source 400 is inserted in the hole of a substrate 410, and fitted to the hole by interference fit or first and second compliant solder joints formed at the interface between the substrate 410 and an adjoining substrate. The power source 400 is surface-mounted on a circuit board 510 of an end user by a reflow soldering and small parts 430 are loaded on the lower part conductive layer of the substrate 410 while large parts 470 and 480 on the upper part conductive layer. Thus, the cost and complexity of the entire electronic integrated device are reduced.
ROZMAN ALLEN FRANK
SANGU D TORONGU
WOODS JR WILLIAM L
Next Patent: SOLDER MOUNTING METHOD OF ELECTRONIC COMPONENT