Title:
POWER SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2016119394
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a power supply device capable of enhancing heat dissipation of heating components.SOLUTION: A power supply device includes a substrate 31 mounting one or a plurality of heating components such as a FET10, a diode 14, a transformer 13 and a coil 15, a fixing member 20 for fixing the substrate 31, and a lid 40 attached to the fixing member 20 and covering the substrate 31. The lid 40 can be attached to the fixing member 20. The lid 40 has a pressing member 41 for pressing the heating component. More specifically, when the lid 40 is attached to the fixing member 20, the pressing member 41 presses a heating component mounted on the substrate 31, or a heating component attached to the housing 20. Consequently, each heating component comes into thermal conduction contact with the lid 31.SELECTED DRAWING: Figure 2
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Inventors:
HAYASHI YOSHIAKI
Application Number:
JP2014258465A
Publication Date:
June 30, 2016
Filing Date:
December 22, 2014
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO WIRING SYSTEMS
AUTO NETWORK GIJUTSU KENKYUSHO KK
SUMITOMO WIRING SYSTEMS
AUTO NETWORK GIJUTSU KENKYUSHO KK
International Classes:
H05K7/20; H01L23/36; H01L23/40; H01L25/00; H02M1/00; H05K9/00
Attorney, Agent or Firm:
Hideno Kono
Nobuo Kono
Nobuo Kono