先供給型半導体封止剤および半導体装置

Title:

先供給型半導体封止剤および半導体装置

Document Type and Number:

Japanese Patent JP5449603

Kind Code:

B1

Inventors:

Hotchi Toyokazu
Yousuke Sakai
Shinichi Soumura

Application Number:

JP2013144354A

Publication Date:

March 19, 2014

Filing Date:

July 10, 2013

Export Citation:

Assignee:

Namics Co., Ltd.

International Classes:

H01L23/29; C08F2/44; H01L23/31; C08F220/30

Domestic Patent References:

Attorney, Agent or Firm:

Asahi Patent Office
Hiroshi Watanabe

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