Title:
先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
Document Type and Number:
Japanese Patent JP6631238
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a prior-supply type underfill material that prevents voids from occurring in a cured product thereof even when it is left in a medium-temperature region, with the cured product also having excellent moisture heat resistance, provide a cured product of a prior-supply type underfill material, provide an electronic component device and provide a method for producing an electronic component device.SOLUTION: A prior-supply type underfill material comprises a radical-polymerizable compound comprising a compound represented by ethoxylated bisphenol A di(meth) acrylate (I) (ethoxylation numbers independently represent a positive number), a radical polymerization initiator, an inorganic filler, and a flexing agent selected from a diblock copolymer (II) of a (meth) acrylic acid ester comprising a C1-C8 alkyl group and a triblock copolymer (III) comprising the (meth) acrylic acid ester. The content of the compound represented by (I) is 3-30 mass%.SELECTED DRAWING: None
Inventors:
Hidetoshi Inoue
Tomoya Masuda
Shinya Nakamura
Tomoya Masuda
Shinya Nakamura
Application Number:
JP2015249381A
Publication Date:
January 15, 2020
Filing Date:
December 22, 2015
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08F2/44; C08F287/00; C08F290/06; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2015503220A | ||||
| JP2013256547A | ||||
| JP2013008896A |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office