PRECURED PRODUCT BASED ON SILICON COMPOUND AND METHOD FOR MAKING MOLDING THEREFROM

Japanese Patent JP3499393

B2

PROBLEM TO BE SOLVED: To obtain a precured product having high transparency by selecting a mixture comprising a silsesquioxane ladder polymer represented by a specified formula, a silicon compound having SiH groups, a silicon compound having vinylsilyl groups, and a platinum catalyst and showing a specified fluidity.
SOLUTION: A silsesquioxane ladder polymer represented by the formula (wherein R1 to R3 are each H or a monovalent organic group; (l), (m) and (n) are each 0 or a positive integer; and 2≤(l)+(m)+(n)) and having a number-average molecular weight of 500 or above is dissolved in a solvent such as tetrahydrofuran, and a silanol condensation catalyst comprising a titanium compound and water are added to the solution. Next, a solution prepared by dissolving a silicon compound having at least two SiH groups and a silicon compound having at least two vinylsilyl groups in tetrahydrofuran is mixed with the above silsesquioxane polymer solution, a platinum catalyst, and optionally a polyfunctional silicon compound and a silica cross-linking agent. The resulting solution is heated to about 50°C to form a precured product having a fluidity of 10-1 to 10-6cm3/s at 100°C. This product is preheated, then compression-molded at 50-500°C under a pressure of 1-500kgf/cm2, and heat-treated to obtain a molding.

Manabu Tsumura
Masafumi Hiraishi
Takahisa Iwahara

JP3065397A

February 23, 2004

February 14, 1997

Click for automatic bibliography generation  

Kanegafuchi Chemical Industry Co., Ltd.

C08J5/00; C08G77/42; C08G77/44; C08K5/54; C08K5/541; C08K5/5415; C08L83/04; C08L83/05; C08L83/07; (IPC1-7): C08L83/04; C08J5/00; C08K5/541; C08L83/05; C08L83/07

JP6256518A
JP8225647A
JP8319422A
JP9278901A

Tadashi Hagino (3 outside)

Previous Patent: SEMICONDUCTOR DEVICE AND APPARATUS FOR MOUNTING THE SEMICONDUCTOR DEVICE ON CIRCUIT BOARD

Next Patent: MICROWAVE INTEGRATED CIRCUIT