PRECURSOR FOR METAL-CONTAINING FILM

Title:

PRECURSOR FOR METAL-CONTAINING FILM

Document Type and Number:

Japanese Patent JP2005002099

Kind Code:

A

Abstract:

To provide a method for producing a pure metal compound film which hardly causes a copper film etc. to be peeled off during chemo-mechanical polishing.

A metal coordination complex of a 1-azaallyl compound represented by the formula, e.g. Et(N)C(tBu)CH2SiMe3 (wherein Et is ethyl; tBu is tert-butyl; and Me is methyl), is used as a precursor for metal-containing film. By CVD or ALD of the metal coordination complex, a metal film and a metal compound film, e.g. a metal nitride film or a metal oxide film, are deposited on an electronic material substrate.

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Inventors:

NORMAN JOHN A T

Application Number:

JP2004126997A

Publication Date:

January 06, 2005

Filing Date:

April 22, 2004

Export Citation:

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Assignee:

AIR PROD & CHEM

International Classes:

C07F1/00; C07F1/02; C07F1/08; C07F7/10; C23C16/18; C07D213/06; H01L21/285; H01L21/768; (IPC1-7): C07F7/10; C07D213/06; C23C16/18

Attorney, Agent or Firm:

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama

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