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Title:
PREFORM FOR MULTI-LAYER HOLLOW MOLDING USING RESIN CONTAINING INFRARED ABSORBENT AS INTERMEDIATE LAYER, MULTI-LAYER HOLLOW MOLDING, AND METHOD FOR PRODUCING THE MOLDING
Document Type and Number:
Japanese Patent JP2001179811
Kind Code:
A
Abstract:

To shorten the molding cycle of a multi-layer hollow molding by forming the intermediate layer of a multi-layer bottomed cylindrical preform from a thermoplastic resin composition having an improved heat absorption capacity when the preform is heated and to prevent the deterioration in the smell, taste, hue, etc., of the contents of the hollow molding by ladding an infrared absorbent into the intermediate layer of the hollow molding.

The intermediate layer of the preform for blow-molding the hollow molding is formed from the resin composition containing the infrared absorbent. The multi-layer hollow molding is formed by blow-molding the preform. In a method for producing the hollow molding, the preform, after being heated by an infrared heater, is blow-molded.


Inventors:
KIYOMIYA TATSUYA
HATAHO SUSUMU
Application Number:
JP37177899A
Publication Date:
July 03, 2001
Filing Date:
December 27, 1999
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
B65D1/00; B29B11/08; B29C49/22; B65D1/09; C08J5/00; (IPC1-7): B29C49/22; B29B11/08; B65D1/09; C08J5/00
Attorney, Agent or Firm:
Shunichiro Suzuki (1 person outside)



 
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