PURPOSE: To prepare a highly conductive phenolic resin molding compound, by attaching an electrically conductive powder having specific particle size, to a granular phenolic resin molding compound having specific grain size.

CONSTITUTION: A granular phenolic resin molding composition wherein ≥80% of the compound is 5W100 mesh grains, is prepared by compounding a phenolic resin with a curing agent such as hexamine and an organic or inorganic filler such as Cellulosin, CaCO3, etc., heating and kneading the mixture, and crushing to the desired size. The objective compound is obtained by mixing a the above phenolic resin with (b) 10W40wt% of a conductive material such as carbon, graphite, metal powder, etc., wherein ≥90% of the material is powder finer than 100 mesh, and (c) a proper amount of solvent having boiling point of ≤120°C, e.g. water, methanol, acetone, etc., and drying the resulting mixture composed of the molding compound covered with a mixture of the conductive material and the solvent, at 80W100°C.