PREPARATION OF HIGH MOLECULAR WEIGHT POLYAMIDE

Title:

PREPARATION OF HIGH MOLECULAR WEIGHT POLYAMIDE

Document Type and Number:

Japanese Patent JPS5430294

Kind Code:

A

Abstract:

{PG,1 A process for making a high molecular weight polyamide, wherein a diacid-rich component and a diamine-rich component are prepared separately in nonstoichiometric proportions, each of these components melting below the melting temperature of the polyamide product, and preferably below 200{20 {0 C; and then the diacid-rich component and the diamine-rich component are contacted in liquid state at high enough temperature to prevent solidification, and in proportions such that the total amounts of diacid and diamine, whether combined or not, are as much as possible stoichiometric. A major utility of this process is in the production of Nylon 66, a known fiber-forming polyamide and engineering plastic.

More Like This:

WO/1981/001293	ACETYLENE TERMINATED IMIDE OLIGOMERS HAVING IMPROVED SOLUBILITIES AND LOWER MELTING POINTS
WO/2009/138692	METHOD FOR INCREASING THE DIFFERENCE BETWEEN THE MELTING TEMPERATURE AND THE CRYSTALLIZATION TEMPERATURE OF A POLYAMIDE POWDER

Inventors:

JIEROOMU UIRIAMU SUPURAUAA

Application Number:

JP9589678A

Publication Date:

March 06, 1979

Filing Date:

August 08, 1978

Export Citation:

Click for automatic bibliography generation Help

Assignee:

DU PONT

International Classes:

C08G69/28; C08G69/00; (IPC1-7): C08G69/28

Previous Patent: JPS5430293

Next Patent: URETHANE PREPOLYMER COMPOSITION