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Title:
PREPARATION OF NOODLE CONTAINING GOLD FOIL
Document Type and Number:
Japanese Patent JPH037551
Kind Code:
A
Abstract:

PURPOSE: To easily and surely apply gold foil to noodles and obtain noodles containing gold foil resistant to peeling off in boiling water by forming recesses on a noodle dough, attaching a gold foil to the recess, scattering dusting powder and rolling and extending the dough.

CONSTITUTION: Wheat flour (medium wheat flour) is mixed with saline water, sealed and aged for a prescribed period. Optionally after maintaining the flour at a low temperature, dusting powder such as corn starch is scattered to the dough and the dusted dough is rolled with a roller to a thickness of 5-6mm. After removing the dusting powder from a prescribed part of the noodle dough, a number of recesses are formed on the removed part, a proper amount of gold foil is applied to the recesses, a dusting powder is scattered on the foil and the dough is rolled to a prescribed thickness and slit into thin strips to obtain the objective noodles containing gold foil.


Inventors:
TOYOSHIMA KUNITAKE
Application Number:
JP14161189A
Publication Date:
January 14, 1991
Filing Date:
June 03, 1989
Export Citation:
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Assignee:
TOYOSHIMA KUNITAKE
International Classes:
A23L7/109; (IPC1-7): A23L1/16
Domestic Patent References:
JPS63258549A1988-10-26
Attorney, Agent or Firm:
Kiyoshi Monna



 
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