Title:
PREPARATION OF PARTICLE BOARD
Document Type and Number:
Japanese Patent JPS6063108
Kind Code:
A
Abstract:
PURPOSE: To obtain the titled board easy to release from a hot plate and a metallic mold by a method wherein a hot press and a patch plate are coated with polyisocyanate compound, wax and water and chips coated with polyisocyanate compound are molded in a press.
CONSTITUTION: A hot press and a patch plate are coated previously with polyisocyanate compound such as trilene diisocyanate etc., wax having a melting point 60°C are more such as carnauba wax etc. and water. Then, chips coated with polyisocyanate compound are molded by the above-mentioned hot press and a patch plate to obtain the desired particle board. Additionally above chips are preferably covered with wax having the melting point 60°C and more.
Inventors:
YANAGI HEIJIROU
KURUO ISAO
OOTANI TOSHIAKI
KURUO ISAO
OOTANI TOSHIAKI
Application Number:
JP17130883A
Publication Date:
April 11, 1985
Filing Date:
September 19, 1983
Export Citation:
Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
B27N3/08; B27N3/02; B29C33/60; (IPC1-7): B27N3/02