Title:
PREPARATION OF RESIN COMPOSITION FOR LAMINATED BOARD AND LAMINATED BOARD
Document Type and Number:
Japanese Patent JPH05140266
Kind Code:
A
Abstract:
PURPOSE:To prepare the subject compsn. which intercepts ultraviolet rays and has a high resistance to heat and chemicals by compounding an epoxy compd. having a naphthalene or anthracene backbone into the compsn. CONSTITUTION:An epoxy compd. having a naphthalene or anthracene backbone is compounded into the subject compsn. The obtd. compsn. is impregnated into a sheet like substrate and dried. The resulting prepreg, alone or together with other kinds of prepreg, is thermally press molded to give a laminated board which intercepts ultraviolet rays and has a high resistance to heat and chemicals. While the curing of an ultraviolet-curable solder resist is generally accelerated by ultraviolet rays having wavelengths of 300-400nm, the compsn, contg. the compd. absorbs and hence intercepts ultraviolet rays having the above-mentioned wavelengths because of the presence of the naphthalene or anthracene backbone in the compd.
Inventors:
YAMAGUCHI TAKAHIRO
TAKAHASHI KATSUHARU
TAKAHASHI KATSUHARU
Application Number:
JP30735791A
Publication Date:
June 08, 1993
Filing Date:
November 22, 1991
Export Citation:
Assignee:
SHIN KOBE ELECTRIC MACHINERY
International Classes:
B29C70/06; B32B15/08; B32B27/38; B32B37/10; C08G59/20; C08J5/04; C08J5/24; C08L63/00; H05K1/03; B29K63/00; B29K105/08; B29L9/00; B29L31/34; (IPC1-7): B29C67/14; B29K63/00; B29K105/08; B29L9/00; B29L31/34; B32B15/08; B32B27/38; B32B31/20; C08G59/20; C08J5/04; C08J5/24; C08L63/00; H05K1/03