Title:
PREPREG AND LAMINATED PLATE
Document Type and Number:
Japanese Patent JP3514146
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a prepreg that has the multilayer structure and excellent heat resistance and is suitable for producing printed circuit boards by impregnating the base material with a resin composition containing compound bearing an oxazolidinone structure in its skeleton and a trifunctional epoxy resin compound, then drying the impregnated product.
SOLUTION: The base material is impregnated with a resin composition that contains a compound containing the oxazolidinone structure represented by the formula in the structure, and a trifunctional epoxy resin compound, preferably at a weight ratio of 3/1-8/1, preferably a resin composition containing a tetrabromobisphenol A type epoxy resin and a dicyandiamide-containing resin, and dried to give the objective prepreg. In a preferred embodiment, the resin composition contains 2-ethyl-4-methylimidazole.
Inventors:
Watanabe, Tatsuya
Misawa, Hideto
Hosoki, Nobuhito
Noguchi, Yutaka
Misawa, Hideto
Hosoki, Nobuhito
Noguchi, Yutaka
Application Number:
JP33390098A
Publication Date:
March 31, 2004
Filing Date:
November 25, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H05K1/03; B32B5/28; B32B17/04; C08J5/10; C08J5/24; C08L63/00; (IPC1-7): C08J5/24; B32B5/28; B32B17/04; C08L63/00; H05K1/03
Attorney, Agent or Firm:
西川 惠清 （外１名）