Title:
PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD USING PREPREG AND LAMINATED BOARD
Document Type and Number:
Japanese Patent JP2000301534
Kind Code:
A
Abstract:
To provide a prepreg which can be used in a high speed wire bonding and has a high surface hardness at high temperatures and a small surface roughness, and provide a metal-clad laminated board, and a printed wiring board using the prepreg and laminated board.
A base material is impregnated with a resin composition containing a resin and inorganic filler of 25 vol.% or more and a silicone polymer to provide a prepreg, and a metal foil is superposed on both sides or on one side of the prepreg or a laminated body thereof, which is heated and pressed to provide a metal-clad laminated board, so that the printed wiring board is obtained by printing wiring on the laminated board. The resin composition contains a coupling agent.
More Like This:
Inventors:
TAKANO MARE
FUKUDA TOMIO
MIYATAKE MASATO
OSE MASAHISA
FUKUDA TOMIO
MIYATAKE MASATO
OSE MASAHISA
Application Number:
JP2000041462A
Publication Date:
October 31, 2000
Filing Date:
February 15, 2000
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K1/03; B29B11/16; B32B5/28; B32B15/08; B32B27/20; C08J5/08; C08J5/24; B29L9/00; (IPC1-7): B29B11/16; B32B5/28; B32B15/08; B32B27/20; C08J5/08; C08J5/24; H05K1/03
Attorney, Agent or Firm:
Kunihiko Wakabayashi