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Patent Searching and Data


Title:
PREPREG AND METHOD FOR PRODUCING MOLDED PRODUCT USING THE SAME
Document Type and Number:
Japanese Patent JP2014231588
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a prepreg which is excellent in storage stability and can be thermally cured in a short time even when the heating temperature is relatively low.SOLUTION: The prepreg includes a fiber substrate and a curable resin composition containing: a curable compound as a main agent which has at least two epoxy groups in the molecule; a compound as a curing agent which has a mercapto group in the molecule; and a base generating compound as a curing catalyst which generates a basic substance upon electromagnetic wave irradiation or heating after electromagnetic wave irradiation. As the base generating compound, a compound represented by general formula (I) is used.

Inventors:
HOSHI KENTARO
TANIGUCHI TAKAHISA
AMANO HIROKO
MOTOOKA ASAMI
Application Number:
JP2013114389A
Publication Date:
December 11, 2014
Filing Date:
May 30, 2013
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
C08J5/24; C08G59/68; C08K3/00; C08L63/00
Domestic Patent References:
JP2013087154A2013-05-13
JP2004231974A2004-08-19
JPH08283383A1996-10-29
JP2006045406A2006-02-16
JP2013087149A2013-05-13
JP2013095706A2013-05-20
JP2010254982A2010-11-11
Attorney, Agent or Firm:
Katsunuma Hirohito
Yukitaka Nakamura
Nobutaka Yokota
Mari Asano